Key Applications 

- 3D Rendering
 - Astrophysics Simulation
 - Chemistry Simulation
 - Virtualization
 - Cloud Computing
 - Research Laboratory/National Laboratory

 Key Features

1. Dual Root System for balanced
    performance & higher CPU
    to GPU communication

2. Dual Socket P (LGA 3647) support
    2nd Gen Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)^‡

3. 24 DIMMs; up to 6TB 3DS ECC
    DDR4-2933MHz^† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM^††

4. 8 PCI-E 3.0 x16 slots
    (support up to 8 double width GPU),
    2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4

5. Up to 24 Hot-swap 2.5" drive bays;
    8x 2.5" SATA drives supported
    with included H/W, 2x 2.5" NVMe
    drives supported with included H/W,
    1 NVMe based M.2 SSD

6. 2x 10GBase-T LAN ports via Intel C622

7. 8 Hot-swap 92mm RPM cooling fans

8. 2000W (2+2) Redundant Power
    Supplies Titanium Level (96%+)