Key Applications 

- 3D Rendering
- Astrophysics Simulation

- Chemistry Simulation
- Virtualization
- Cloud Computing

- Research Laboratory/National Laboratory
 Key Features

1. Dual Root System for balanced performance & higher CPU to GPU communication

2. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡

3. 24 DIMMs; up to 6TB 3DS ECC
DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

4. 8 PCI-E 3.0 x16 slots
(support up to 8 double width GPU),
2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4

5. Up to 24 Hot-swap 2.5" drive bays;
8x 2.5" SATA drives supported with included H/W
2x 2.5" NVMe drives supported with included H/W
1 NVMe based M.2 SSD

6. 2x 10GBase-T LAN ports via Intel C622

7. 8 Hot-swap 92mm RPM cooling fans
8. 2000W (2+2) Redundant Power Supplies Titanium Level (96%+)